Wafer header connector

SH1.0 pin seat horizontal sticker 6PWB

TYPE-C manufacturersShenzhen Bubujing Technology Co., Ltd. is a professional wafer pin connector manufacturer and custom manufacturer, providing SH1.0 pin seat horizontal paste 6PWB wholesale and procurement, and the price is affordable. The products sell well in Beijing, Shanghai, Guangzhou, Shenzhen, Dongguan, Xiamen, Suzhou, Ningbo and other places.

The needle seat of TYPE-C manufacturers is composed of 4 modules of pitch, PIN position, structure and thickness. The pitch is divided into: 0.8mm, 1.0mm, 1.25mm, 1.5mm, 2.0mm, 2.54mm and 3.96mm, etc. PIN position : 2-30P; The structure is divided into: horizontal stickers, vertical stickers, straight inserts and curved inserts.

Connectors, also known as connectors, plugs and sockets. Electric current or signals are transmitted through electronic connectors. The function of the connector: a communication bridge is built between the circuits that are blocked or isolated in the circuit, so that the current flows and realizes the circuit Predetermined function. It makes the design and production process more convenient and flexible, reducing production and maintenance costs. It improves the production process and simplifies the assembly process of electronic products. It also simplifies the mass production process, is easy to maintain and upgrade, and improves the design flexibility.

Some important products generally need to ensure the quality of the needle seat, depending on the pulling force and plugging life of the needle seat, such as the wire-to-board connector needle seat.

One end of the needle socket is inserted on the board end, and the terminal connecting wires are connected one by one to make the circuit smooth. There are as many lines (lines) of wires as there are as many pins. In this way, two active devices that require a lot of effort to connect can be It's done in an instant, and it also saves space. So although it's a small needle holder, it's very functional.

The development of connectors will be miniaturization, high density, high speed transmission and high frequency.